New Solutions for Semiconductor Industry by Marposs • EVreporter

MARPOSS GROUP STRENGTHENS ITS PRESENCE IN THE SEMICONDUCTOR AND CONSUMER ELECTRONICS SEGMENT ALSO.

Controlling and maintaining a process is the key factor for any production. This is even more true for the very demanding semiconductor and semiconductor-like manufacturing processes, which can be considered some of the most complex ones and require the control of an increasing number of parameters. Not to mention that semiconductors are brittle and hard materials requiring dedicated machine tools to slice, lap, thin, intelligent, and cut the die.

Inspection and metrology are key factors in improving and maintaining high yield. They are also crucial for managing the semiconductor manufacturing process and finding defects on patterned and unpatterned wafers.

Marposs engineers are ready to support you in defining how to improve the performance of automatic machines used during wafer processing and the front-end and back-end fabrication steps. Indeed, we offer sensors and gauges for slicing and lapping machines, back grinders, dicing saws, wafer shape (bow/warp) measurements, layer and pattern measurements, and bump and groove measurements.

The semiconductor and semiconductor-like industries continue to produce ever-smaller devices that are more complex in both shape and materials. For these purposes, Marposs has a complete range of non-contact sensors used for thin-film metrology, wafer dimensional characterization, wafer inspection, and packaging inspection. Our sensors can work inside automatic inspection machines to find defects and dimensional variations.

Here are some examples of how our products can be of profitable use.

Solarius

Marposs announced the acquisition of Solarius Development Inc., a leading provider of high-tech manufacturing solutions for the Consumer Electronics and Semiconductor Industry.

The new Phoenix Desktop 3D surface measuring system from Solarius enables highly accurate and precise 3D surface inspection. Phoenix’s extensive equipment expands the scope of application, particularly supporting simple automation of measurement tasks.

Phoenix Desktop 3D system is based on the Chromatic confocal technique dedicated to industrial environments, independent from ambient light. Sub-micrometric accuracy and nanometric Axial resolution are also important in the design and calculation of the optics. A physically optimal direction limitation of the optics allows for accurate, precise, and repeatable lateral measurements.

Phoenix features a comfortable and precise automated X/Y positioning unit with a 150mm x 150mm travel range and a height measuring range of 100m. The height measuring range can be adjusted up to 150mm in height using an accurate, manual traversing unit. Phoenix has six available sensor types with sensor heads and 45, 90, or 180 points of measure, designed to meet the metrology requirements in mechanics, semiconductors, 3C, Glass, Automotive, Aerospace, and Medical.

2-NCG Thin Line

NCG is a distance/thickness measurement system based on interferometric technology: waves, reflected at the layer boundaries of different surfaces (two or even more in case of multilayer material) of the object being measured, are brought to interference, and the layer thickness is then calculated. The gauge has been designed to control the thickness of parts of different materials such as silicon, doped silicon, SiC, Sapphire, GaN, Glass, GaAs, SOI, plastic and so on. Thanks to infrared light sources, it is possible to measure non-transparent materials, too. NCG can be equipped with different light emitters that cover multiple thickness ranges for each material down to a lower limit of a few microns. A wide range of interferometric probes is available to fit measurements performed in clean environments and harsh conditions typical of machine tools.

NCG is also equipped with a powerful measure elaboration SW able to provide a ‘clean’ measurement even in an optical noisy environment and efficiently track the measure of each single layer in case of multilayer materials that can easily confuse each other.

NCG can be programmed through a dedicated human interface that suits all offline applications. Moreover, measurements carried out by NCG can be forwarded to other machines (Machine Tools, Complex Measuring Benches, or similar) through different protocols provided with a special SW package together with the electronic unit.

3-P3CF + Unimar

P3CF is a high-precision measurement system combining chromatic confocal and touch measurement technology. The confocal probe is connected to the controller via a fibre optic cable. Different confocal probe models are available to fit measurements performed in both clean environments and harsh conditions typical of machine tools. Contact probes belong to the UNIMAR family week and are known for their versatility and reliability in any machining.

P3CF is the ideal solution for providing an indirect thickness measurement. When direct thickness measurement is not possible cause the material cannot be penetrated by standard NIR (Near InfraRed) waves, the thickness of the target can be measured by getting the distance of the target through the confocal probe (avoiding touching it) and subtracting the distance of the support of the target detected with standard UNIMAR (support is usually tough and often does not have good light reflectance, so contact probe is the perfect solution).

P3CF can be programmed through a dedicated human interface that suits all offline applications.

Moreover, measurements carried out by P3CF can be forwarded to other machines (Machine Tools, Complex Measuring Benches, or similar) through different protocols provided with a special SW package together with the electronic unit. The system also supports the most common fieldbus types for high-level integration in the factory network.

Discover more aboutMarposs solutionsfor the semiconductor industry and visithttp://www.stilsa.com/.

For More Details, you can also Call Marposs in India – at 0124 473 5776/765 or e-mail to Sales@in.marposs.com